Yokohama:Samsung Electronics Co. Chairman Lee Jae-yong recently visited the company's Advanced Package Lab (APL) in Japan, highlighting its role as a global research and development hub for enhancing artificial intelligence (AI) chip performance.
According to Yonhap News Agency, Samsung Electronics announced that the facility, based in Yokohama, held its opening ceremony in September. The lab is dedicated to the development and validation of key technologies necessary for advanced semiconductor packaging, leveraging Japan's expertise in materials, components, and equipment.
During his visit, Lee met with APL researchers to discuss the progress in developing essential materials and process technologies for advanced packaging. He also explored ways to strengthen cooperation with Japanese companies in the relevant sectors. Lee emphasized the critical importance of securing advanced packaging technologies to maintain competitiveness in the semiconductor industry, especially in the AI era.
Samsung established the APL in 2023 and spent two years preparing the facility and conducting initial research and development activities before its official opening. The company plans to invest 350 billion won (approximately US$262 million) in the R&D facility over the next five years, through 2028.