Seoul: LG Innotek Co., a major South Korean electronics parts maker, has developed a next-generation smart integrated circuit (IC) substrate that cuts carbon emissions during the manufacturing process by nearly 50 percent compared with existing products, the company said Wednesday.

According to Yonhap News Agency, smart IC substrates are essential parts used to mount IC chips containing personal security data in credit cards, electronic passports, and smartphone universal subscriber identity module (USIM) cards. LG Innotek has introduced a new product that eliminates the need for precious-metal plating by applying a new high-performance material.

The new substrate can reduce annual carbon emissions by 8,500 tons, an amount equivalent to planting about 1.3 million trees. Additionally, the company stated that the substrate's durability has been strengthened about threefold.

LG Innotek has commenced mass production of the new smart IC substrate in November for a major global smart-card manufacturer. The company has also secured around 20 domestic patents related to the technology and plans to register additional patents in the United States, Europe, and China.