Incheon: Samsung Electro-Mechanics Co. and LG Innotek Co. on Wednesday showcased their latest package substrates for artificial intelligence, server, and automotive sectors at a components industry exhibition. The electronic components arms of Samsung Group and LG Group displayed their advancements at the International Electronics Circuits and Advanced Packaging Show 2025, which began its three-day run in Incheon, west of Seoul.

According to Yonhap News Agency, package substrates like the flip-chip ball grid array (FCBGA) are crucial for transmitting electrical signals between chips and mainboards. Samsung Electro-Mechanics, currently the only South Korean company mass-producing FCBGAs for servers, introduced advanced package substrates tailored for high-performance semiconductors. Additionally, Samsung presented a glass core package substrate that is notably 40 percent thinner than existing models. Samsung Electro-Mechanics Vice President Kim Eung-soo emphasized the company's distinctive technology in high-end semiconductor package substrates, which are applicable in AI, autonomous driving, and servers. Kim also highlighted the company's commitment to expanding global client cooperation based on their technological competitiveness.

LG Innotek Co., on the other hand, highlighted its copper post technology for high-value-added semiconductor substrates used in mobile devices. This technology involves using a copper post to connect chip substrates and mainboards, allowing substrates to support more circuits and enhance heat efficiency. LG Innotek Vice President Kang Min-seok stated that the company aims to lead the global market by providing differentiated client experiences through its innovative substrate technologies and products, particularly those incorporating copper post technology.