Accra:California SK hynix Inc. has unveiled its next-generation artificial intelligence (AI) memory technologies, aiming to expand AI infrastructure beyond traditional high-bandwidth memory (HBM).

According to Yonhap News Agency, the South Korean chip manufacturer presented these innovations at the OCP Global Summit 2026, which took place in California from Tuesday to Thursday. The summit, organized annually by the Open Compute Project Foundation, gathers engineers and industry leaders to discuss advancements in computing technologies.

The company arranged its exhibition area into two distinct sections. The front, known as the memory section, displayed the company's flagship products, while the larger rear section, called the system demo section, showcased memory solutions intended to support the next generation of server ecosystems.

Kim Ho-sik, a senior vice president at SK hynix, introduced the MARS (Memory-Centric AI Rack-Scale System), a new architecture designed to integrate computing and memory resources efficiently. He also highlighted developments in High Bandwidth Flash (HBF) technology to meet the increasing industry demand for greater memory capacity.

Additionally, SK hynix revealed its second-generation 256-gigabyte memory product based on Compute Express Link (CXL) 3.2. This new product delivers more than twice the bandwidth of its predecessor and offers an approximate 30 percent improvement in energy efficiency.