Seoul: SK hynix Inc. has placed an order for advanced high bandwidth memory (HBM) production equipment from Hanmi Semiconductor Co., as revealed in a recent regulatory filing. This move potentially indicates preparations for the anticipated production of next-generation HBM4 products.

According to Yonhap News Agency, Hanmi Semiconductor, a local manufacturer known for its chip production equipment, disclosed plans to deliver thermo-compression (TC) bonders valued at 9.7 billion won (approximately US$6.5 million) to SK hynix by April. This equipment is fundamental in HBM production, as it stacks multiple dynamic random access memory (DRAM) chips to create HBM.

With each TC bonder generally priced at about 3 billion won, industry observers suggest that the agreement likely involves three units. It is expected that these units are the TC Bonder 4 models, which are suitable for the production of the upcoming HBM4 products.

SK hynix is accelerating efforts to boost its HBM production capacity in response to rising demand from the artificial intelligence (AI) sector. The company is preparing for comprehensive commercialization of the advanced HBM4 at its facility in Cheongju, located roughly 110 kilometers south of Seoul.

Earlier this month, SK hynix announced its goal to secure a prominent position in the memory industry by 2026. The company aims to sustain its leadership in HBM3E while strategically building an ecosystem for HBM4.