Seoul: Samsung Electronics Co. announced it has commenced the shipment of samples for its latest high-bandwidth memory chip, the 12-layer HBM4E, marking a significant milestone as the world's first shipment of this next-generation AI memory product. This achievement comes only three months after Samsung led the industry by initiating mass production and shipments of its sixth-generation HBM4 chips in February, reinforcing its strategic position in the expanding AI memory market.

According to Yonhap News Agency, the HBM4E chip delivers performance through optimized chip design and manufacturing processes. The chip is designed to support data transfer speeds of up to 16 gigabits per second per pin, which represents an increase of more than 20 percent over the previous HBM4 lineup. Additionally, the HBM4E offers a bandwidth of up to 3.6 terabytes per second per stack, facilitating faster processing speeds necessary for large language models and next-generation AI systems.

"Following the successful mass production of HBM4, Samsung has completed the shipment of next-generation HBM4E samples without disruption, further solidifying its technological leadership in the market," stated Hwang Sang-joon, head of memory development at Samsung Electronics, in a press release. The company expressed plans to align mass production of the HBM4E with customer schedules subsequent to the sample shipments.

Samsung's clientele includes major players in the AI sector, such as Advanced Micro Devices (AMD) Inc., Nvidia, and Google.