Seoul: Samsung Electronics Co. Chairman Lee Jae-yong met with Lisa Su, CEO of Advanced Micro Devices Inc. (AMD), in Seoul on Wednesday, signaling a significant push for cooperation in the field of artificial intelligence (AI) chips. The meeting, which took place at Seungjiwon, a venue frequently used by Samsung for business engagements with key industry figures, underscores the strategic importance of this collaboration for both companies.
According to Yonhap News Agency, the meeting followed Samsung Electronics' announcement earlier in the day of an agreement with AMD to supply its latest high-bandwidth memory (HBM) chips for AMD's upcoming AI accelerators. Under the terms of the memorandum of understanding (MOU), Samsung Electronics has been appointed as a preferred supplier of HBM4 for AMD's Instinct MI455X, the company's latest graphics processing unit (GPU) designed for AI data centers. This marks the first official HBM4 agreement for Samsung since it began shipping the chips in February.
Samsung's sixth-generation HBM4 chips, which utilize a 4-nanometer logic process on the base die, offer remarkable data control efficiency. These chips can achieve data transfer speeds of up to 13 gigabits per second (Gbps) and a bandwidth of up to 3.3 terabits per second (Tbps). The collaboration between Samsung and AMD extends beyond memory solutions; the companies also plan to work together on high-performance double data rate 5 (DDR5) memory solutions. These will support AMD's Helios, a next-generation rack-scale AI platform, and AI data center GPUs.
In addition to next-generation memory, Samsung and AMD aim to expand their cooperation to include advanced foundry and packaging services, further driving innovation in the AI computing ecosystem. Since 2007, Samsung and AMD have maintained a partnership, with Samsung supplying graphics double data rate (GDDR) dynamic random-access memory (DRAM) for AMD's graphics cards.
During the MOU signing ceremony held in Pyeongtaek, Vice Chairman Jun Young-hyun emphasized the shared vision of both companies: "Samsung and AMD share a common goal of advancing AI computing, and this agreement will expand the scope of our collaboration. From industry-leading HBM4 and next-generation memory architectures to cutting-edge foundry and packaging technologies, Samsung offers comprehensive capabilities to support AMD's AI roadmap."
Source: Yonhap News Agency