Seoul: Samsung Electronics Co. announced its participation in a consortium led by Netherlands-based ASML to develop pioneering semiconductor manufacturing technologies. This collaboration focuses on advancing 12-inch photomask technology, replacing the long-standing 6-inch format in semiconductor manufacturing.

According to Yonhap News Agency, the partnership between Samsung and ASML aims to accelerate technological advancements that will meet the growing demands of advanced semiconductor manufacturing. Samsung highlighted that this initiative will enhance fab productivity and reduce chipmaking costs, particularly as demand for artificial intelligence (AI) chips continues to rise.

Samsung Electronics CEO Jun Young-hyun emphasized the transformative impact of AI on the semiconductor industry, which underscores the need for continuous technological innovation. He stated that the strengthened collaboration with ASML is crucial for laying the groundwork for future AI and semiconductor innovations.

Furthermore, Samsung plans to integrate ASML's High NA extreme ultraviolet (EUV) lithography technology into high-volume manufacturing of dynamic random-access memory (DRAM) by 2028. This technology is anticipated to provide improved resolution, simplify processes, and increase manufacturing efficiency, thereby extending the DRAM scaling roadmap.