Las vegas: SK hynix Inc. announced plans to showcase its latest high bandwidth memory (HBM) chip, the 16-layer HBM4 with a capacity of 48 gigabytes, at CES 2026. This move underscores the company's leadership in the artificial intelligence (AI) memory sector.

According to Yonhap News Agency, SK hynix has established a showroom at the Venetian Expo in Las Vegas to display its AI memory solutions under the theme "Innovative AI, Sustainable Tomorrow." The 16-layer HBM4 48GB chip, which is a successor to the company's 12-layer HBM4 36GB model, will be exhibited for the first time. The development of this latest model is in progress, aligned with customer schedules.

The South Korean chip giant will also feature an Nvidia Corp. graphics processing unit (GPU) module equipped with its HBM3E chips, now extensively used in AI computing. Amid an ongoing partnership, SK hynix Chief Executive Officer (CEO) Kwan Noh-jung met with Nvidia officials in Las Vegas on Monday (local time), where they are believed to have discussed cooperation, as reported by industry sources.