Seoul: South Korean chipmaker SK hynix Inc. announced the completion of its development of HBM4, the next-generation high-bandwidth memory (HBM) chip, and its readiness for mass production aimed at ultra-high performance artificial intelligence (AI) applications.

According to Yonhap News Agency, HBM is a crucial component for AI applications, with a significant increase in demand as it greatly enhances data-processing speeds in data centers. SK hynix has become the first company in the industry to complete preparations for mass production of the next-generation HBM chip, with production set to take place at its Incheon plant, located about 54 kilometers east of Seoul.

The company highlighted that HBM4 offers more than a 40 percent improvement in power efficiency compared to its predecessor, the HBM3E, and can enhance AI service performance by up to 69 percent. With improved bandwidth and power efficiency, HBM4 is anticipated to address growing market needs by alleviating data bottlenecks and reducing energy costs in data centers, as stated by SK hynix in a press release.

Cho Joo-hwan, vice president in charge of HBM development at SK hynix, remarked that the completion of HBM4 development marks a new milestone for the industry. Additionally, Kim Ju-seon, president and head of AI infrastructure at SK hynix, described the development of HBM4 as a “symbolic turning point” that surpasses the limitations of AI infrastructure and tackles technological challenges in the AI era.