Pyeongtaek: Samsung Electronics Co. announced it has entered an agreement with Advanced Micro Devices Inc. (AMD) to provide its high bandwidth memory (HBM) chips for AMD's upcoming artificial intelligence (AI) accelerators. The memorandum of understanding (MOU) designates Samsung as a preferred supplier of HBM4 for AMD's Instinct MI455X, the latest graphics processing unit (GPU) for AI data centers.

According to Yonhap News Agency, the deal represents Samsung Electronics' first official HBM4 agreement since the company began shipping the chips in February. Lisa Su, the CEO of AMD, was in South Korea as part of the partnership arrangement. Samsung's sixth-generation HBM4 uses a 4-nanometer logic process on the base die, enhancing data control efficiency with data transfer speeds reaching up to 13 gigabits per second (Gbps) and bandwidth of up to 3.3 terabits per second (Tbps).

Both companies will also work together on high-performance double data rate 5 (DDR5) memory solutions to aid AMD's Helios, a future rack-scale AI platform, in addition to AI data center GPUs. Samsung aims to extend cooperation beyond next-generation memory to advanced foundry and packaging services, pushing innovation within the AI computing ecosystem.

The collaboration between Samsung Electronics and AMD dates back to 2007, with Samsung having previously supplied graphics double data rate (GDDR) dynamic random-access memory (DRAM) for AMD's graphics cards. Vice Chairman Jun Young-hyun stated during the signing ceremony that both companies share the goal of advancing AI computing, emphasizing Samsung's capabilities in supporting AMD's AI roadmap with industry-leading memory architectures and technologies.